• High solids, no-clean, rosin-containing fluxes
• Meets J-STD-004A Type ROL1 and Mil-F-14256 Type RMA, as well as J-STD-004B
• Greater heat stability than low solids fluxes
• Designed for soldering thick and massive circuit boards
• Very heat stable

Wave Soldering Flux Series #2212 is designed to meet current no-clean and historic Mil-F-14256 flux specifications. These fluxes are particularly effective for soldering large and thick circuit boards or for selective soldering operations where long heat profiles are required. The greater solids content retains activity longer through the soldering cycle and also helps to ensure greater surface insulation resistance and overall reliability.

The residue left by Wave Soldering Flux Series #2212 is hard, non-hygroscopic, non-tacky, and transparent. While it is not necessary to remove the residue, it can be cleaned from circuit boards and fixtures using a saponifier or common flux residue remover.

Application

Wave Soldering Flux Series #2212 was originally designed for foam fluxing, but can also be applied by spray. The 15% version is particularly effective when sprayed. When foam fluxing, the following guidelines will help ensure consistent results:

■ Maintain adequate and constant flux level in the fluxing unit
■ Use Indium Corporation #16-2212 Rosin Flux Thinner to compensate for evaporation losses
■ Keep equipment clean and avoid contamination, particularly oil and water
■ Keep the air pressure low and make sure the air lines contain traps to remove water and oils, which may change the foaming properties of the flux