EP256 is a no-clean, air or nitrogen  reflowable solder paste specifically designed for  maximum robustness in reflow profiling and stencil  printing. EP256 has the widest possible reflow  processing window. EP256 is also capable of  stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and  printing characteristics for up to 8 hours without  any shear thinning