AIM Solder
AIM Solder 4089 8153 Surface Mount Chip Bond Epoxy for Dispensing Applications, 30cc Syringe
Our Part #478-178
Condition:New
Mfr Part #4089 8153
AIM Solder
AIM Solder 4089 8153 Surface Mount Chip Bond Epoxy for Dispensing Applications, 30cc Syringe
Our Part #478-178
Condition:New
Mfr Part #4089 8153
Next Day Air Only
Has Expiration Date
$EACH
Multiples of: 10
Next Day Air Only
Has Expiration Date
- Description
- Specifications
- Documents
- Fast curing
- Non-stringing formula
- Good for high speed placement equipment
- One part epoxy
- High shear strength
- Unrefrigerated shelf life of 6 months
Epoxy 4089 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4089 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems, and quick cure properties when exposed
to heat. Viscosity and surface tension of Epoxy 4089 are adequate for use with high speed placement equipment.
Brand:Â AIM Solder
Container Size:Â 30 cc
Container Type:Â Syringe
Storage:Â This material has an unrefrigerated shelf life of 6 months. Clean dispensing nozzles thoroughly after each use. Avoid leaving adhesive in nozzles for extended periods of time. Keep container sealed when not in use. Care should be taken not to allow produc
$EACH
Multiples of: 10