• Contains halogen
• For lead free applications
• Stencil life: 8 hours (process dependent)
• Excellent printing characteristics to <16mil pitch
• Leaves bright/shiny solder joints after reflow
• Can reflow in air or nitrogen environments
• Classified as ROL1 per J-STD-004
• Compliant to Bellcore GR-78

Kester TSF-6502 is a no-clean tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces. The robust wetting action of TSF-6502 will allow OSP treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles. Following reflow, TSF-6502 will leave aesthetically pleasing clear residues on the assembly. TSF-6502 is designed for a wide range of temperature and humidity conditions.