Multicore MF 210 is a low residue, resin and halide-free flux designed for surfaces with poor solderability.

Features and Benefits:

• Minimal residues to interfere with ATE probes without cleaning
• Sustained activity for maximum process window
• Highly effective on difficult to solder surfaces
• High speed soldering on conventional leaded and SMD components without defects
• Good through hole penetration
• Compatible with rosin and OSP based surface preservatives
• Suitable for foam, wave and spray application
• Halide Free

Applications:

MF 210 is recommended for consumer electronics and general electronics applications, particularly where high throughput is desirable. This is a robust product. Its wide process window makes it suitable for applications where there is additional demand for high performance/reliability.