Multicore MF300 and MF300S are low residue, resin and halide-free fluxes, which meet the most demanding legislation on volatile organic compound (VOC) emissions.

Features and Benefits:

• Highly effective on low solderability surfaces, e.g. oxidised copper
• Formulated to minimise solder balling
• No Clean
• <1% VOC - meets US air quality legislation
• Non-flammable formulation
• MF300 suitable for foam application only
• MF300S suitable for wave or spray application

Applications:

Multicore MF300 and MF300S are designed mainly for consumer electronics applications using either conventional or nitrogen inerted wave soldering machines. These fluxes perform well, even when used on poorly preserved copper substrate. They have been designed to minimise solder balling between adjacent pads.