Loctite 1189514 Epoxy Encapsulant

ECCOBOND E 1172 A is formulated for use with very fine area array devices where SMT transparent processing is critical. This material can underfill devices with 25micron geometries. LOCTITE ECCOBOND E 1172 A provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.

Features:

• Color: Tan
• Odor: Slight
• Specific Gravity: 1.68
• Flash Point: > 199.4°F
• VOC Content: < 0.1%