• Meets the requirements of J-STD-004 Type ROL0
• More heat-stable than rosin-free formulas
• More active than most other no-clean formulas
• Wide process window for soldering larger and/or thick circuit boards
• Tested compatibility with a wide range of selective solder operations
• Leaves a smaller amount of post-soldering residue than most ROL1 and ROL0 formulas
• Tested compatibility with Hot Air Solder Leveled (HASL), Immersion Silver, Electroless Nickel Immersion Gold (ENIG), and Organically Solder Preserved (OSP) Copper surfaces
• Tested for use with all common lead-free and tin-lead alloys, including: SAC305; SAC105; SAC0307; silver-free tin-copper plus additive alloys, such as Indium Corporation’s Sn995; 96.5Sn/3.5Ag; 63Sn/37Pb; 60Sn/40Pb; and many others

WF-9948 is a fourth-generation high-performance no-clean wave solder flux designed for use with through-hole and mixed-technology assemblies. While only containing about 3.3% flux solids, WF-9948 is very heat stable and well-suited for selective soldering applications. It performs well with both tin-lead and lead-free solders. WF-9948 has been designed to pass all known reliability requirements, including J-STD-004B SIR and ECM. This modern flux is non-corrosive, compatible with probe testing, compatible with most conformal coatings, and does not contribute to detrimental circuit board insulation resistance degradation or electrochemical migration.