• High transfer efficiency through small apertures (≤0.66 AR)
• Excellent wetting to all common finishes at high and low peak reflow temperatures
• Eliminates head-in-pillow defects
• High oxidation resistance

Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate higher processing temperatures. Indium8.9 offers excellent stencil print transfer efficiency to work in the broadest range of processes. In addition, the superior soldering performance under high temperature and long reflow processes provides exceptional head-in-pillow performance.