• Revolutionary Formula: No Refrigeration Required!
• Printing speeds up to 125mm/sec.
• Long stencil life.
• Wide process window.
• Clear residue.
• Low voiding.
• Excellent wetting compatibility on most board finishes.
• Print grade.
• Compatible with enclosed print heads.
• REACH Compliant (Except Lead).
• Stencil Cleaning: Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
• Storage and Handling: Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use.
• Transportation: This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
• Warning: This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm.

The Chip Quik TS391AX250 Thermally Stable Solder Paste is a premium no-clean solder paste formulated for exceptional reliability and ease of use. What sets this solder paste apart is its revolutionary, thermally stable formula—no refrigeration is required for storage, making it more convenient and easier to handle.