• Eliminates clogged apertures through advanced rheology
• High speed printing (>100mm/second capable)
• Eliminates hot and cold slump
• Excellent wetting
• High oxidation resistance
• Halogen-free per EN14582 test method

Indium's Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Indium8.9HFA
Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Print performance is especially critical for manufacturers of mobile phones and other personal electronics devices, especially as they struggle with <8mil challenges associated with continuing miniaturization in the electronics assembly industry.

Indium8.9HFA Solder Paste provides:

• Low Cost of Ownership & High Print Yields
  • Unsurpassed transfer efficiency for consistent, full volume print deposits (8 mil), results in reduced frequency of insufficients and high first-pass print yields
  • Low print pressure and excellent response-to-pause saves time and money on stencils and line changes
  • Solvent-free dry-wiping reduces costs
• Increased throughput
  • Higher print speed and reduced wipe frequency enables short cycle time, high up-time, and high throughput printing

Indium8.9HFA works best in applications that require:

• Fine feature printing that present challenges for yields (area ratios <0.66); this includes most personal electronics applications
• High speed printing applications (>100mm/second or >4 inches/second)