• Comply with UL (file number E214381) and IPC-4101C/21
• DICY (dicyandiamide) Cured System
• Easy to cut, with no specialized equipment required
• UV blocking
• Available in 1 oz (1.37 mil, 35 µm) and ½ oz (0.67 mil, 17 µm) copper cladding
• Available in 1/16″ (1.60 mm) and 1/32″ (0.80 mm) laminate thicknesses

500 Series Copper Clad Boards for printed circuit board design are made of a laminate comprising continuous woven glass cloth impregnated with epoxy resin. The material is FR4, which is a flame retardant version of G-10 material.

These boards are an ideal material for circuit board design and fabrication, whether for prototyping or small production runs. They are used by PCB manufacturers, design engineers, hobbyists, and student