JensenTools
Kester
Kester

Kester 300303 Tacky Soldering Flux, No-Clean, TSF-6592LV, 30r Syringe

Our Part #KES-TSF6592LV-30G

Condition:New

Mfr Part #300303

Kester 300303
Kester
Kester

Kester 300303 Tacky Soldering Flux, No-Clean, TSF-6592LV, 30r Syringe

Our Part #KES-TSF6592LV-30G

Condition:New

Mfr Part #300303

Next Day Air Only
CA Prop 65
$47.60EACH
Quantity on Order:24
Qty:Price:Savings
1$47.60
5$46.17Save 3%
10$45.22Save 5%
25$44.27Save 7%
100$43.89Save 8%
Next Day Air Only
Calif. Prop 65
  • Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu,SnAgBi
  • Reflow-able with peak temperatures up to 270C
  • Reflow-able in air and nitrogen
  • Bright shiny soldered joints with clear residues
  • Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG
  • Clear non-tacky residues
  • High tack to minimize skewing of components
  • Low voiding
  • Stencil life of 8+ hours (process dependent)
  • Classified as ROL0 per J-STD-004A & J-STD-004B
  • Compliant to Bellcore GR-78

Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.

BrandKester
Container Size30 g
Container TypeSyringe
Flux TypeNo-Clean
TypeTacky
Physical StateTacky
$47.60EACH
Quantity on Order:24
Qty:Price:Savings
1$47.60
5$46.17Save 3%
10$45.22Save 5%
25$44.27Save 7%
100$43.89Save 8%