Kester
Kester 300303 Tacky Soldering Flux, No-Clean, TSF-6592LV, 30r Syringe
Our Part #KES-TSF6592LV-30G
Mfr Part #300303
Kester
Kester 300303 Tacky Soldering Flux, No-Clean, TSF-6592LV, 30r Syringe
Our Part #KES-TSF6592LV-30G
Mfr Part #300303
Condition:New
Next Day Air Only
$56.00EACH
Estimated Mfr lead time:16 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $56.00 | |
| 5 | $53.20 | Save 5% |
| 10 | $50.40 | Save 10% |
| 25 | $47.60 | Save 15% |
Next Day Air Only
- Description
- Specifications
- Documents
- Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu,SnAgBi
- Reflow-able with peak temperatures up to 270C
- Reflow-able in air and nitrogen
- Bright shiny soldered joints with clear residues
- Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG
- Clear non-tacky residues
- High tack to minimize skewing of components
- Low voiding
- Stencil life of 8+ hours (process dependent)
- Classified as ROL0 per J-STD-004A & J-STD-004B
- Compliant to Bellcore GR-78
Kester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.
Brand:Â Kester
Container Size:Â 30g
Container Type:Â Syringe
Flux Type:Â No-Clean
Type:Â Tacky
Physical State:Â Tacky
$56.00EACH
Estimated Mfr lead time:16 Days
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $56.00 | |
| 5 | $53.20 | Save 5% |
| 10 | $50.40 | Save 10% |
| 25 | $47.60 | Save 15% |