• Printing: Consistent fine-pitch print performance and transfer efficiency
• Excellent response-to-pause Tackiness sufficient for high-speed and high-mix SMT assembly
• Outstanding slump resistance
• Defect Elimination: Superb wetting performance Low voiding Humidity resistance
• Robust Reflow Capability: Effective in air or nitrogen environments
• Cleaning: Easily cleaned in warm, pressurized DI water
• Indium 3.2HF Only: Halogen-free version of Indium 3.2

Indium3.2 Pb-free solder paste is water-soluble and contains halogens. It is made with SAC305 and a Type 4 powder. The produce offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s high-speed and high-mix production lines. It also offers superb wetting to Pb-free metallization and has exceptional low voiding performance on fine-pitch components, including BGAs and CSPs.