Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes. R276 is available in Sn63Pb37 and Sn96.5Ag3.0Cu0.5 alloys. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters.