Kester's solder analysis program is a prepaid method for rapid response solder sample analysis. It allows customers to document solder pot impurities for conformance to Federal Specifications or ISO quality requirements. Option C: This option includes monitoring tin, antimony, copper, gold, lead, cadmium, aluminum, zinc, iron, arsenic, bismuth, silver, and nickel. Includes mailer and assigned controlled document instruction sheet.
Tests for impurity levels of Tin (Sn), Antimony (Sb), Copper (Cu), Gold (Au), Cadmium (Cd), Zinc (Zn), Aluminum (Al), Iron (Fe), Arsenic (As), Bismuth (Bi), Silver (Ag), Nickel (Ni), and Lead (Pb).
Minimum Sample Size Required: 50-150 grams (2-5 ounces).
Take a solder sample directly from a wave soldering machine or from a pot after thorough mixing.
Results are typically emailed to you in 5 business days after receipt of the sample.