Global Specialties GS-770 Solderless Breadboard with Bus Strip

Features and Specifications

• 770 Tie-Point
• Maximum capacity of 1.5 A at 36 V
• ABS plastic body
• Nickel plated phosphor bronze spring clip contacts
• Allowable wire diameter of 0.4-0.7 mm
• Fits 7 total 16-pin ICs
• Measures 5.6 x 16.5 x 1.0 cm
• Peel and stick adhesive

A modular type solderless breadboard, the GS-770 is comprised of the GS-090 bus strip and the GS-59 breadboard. Ideal for prototyping low frequency or DC powered circuits.