Loctite 450741 Epoxy Encapsulant

FP4549 liquid epoxy adhesive is designed for enhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 90°C to 110°C with as little as a 1/2 mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance.

Features:

• Color: White
• Odor: Odorless
• Specific Gravity: 1.8
• Flash Point: > 266°F