Solder Fortification® preforms are used in conjunction with solder paste to give more volume (and therefore more strength) to the solder joint than can be achieved through the printing process. This increases the reliability of the joint on the first pass, reducing rework time. It will also give additional strength needed for certain components or connections, helping to reduce field failures.

Solder Fortification Preforms are the solution for unreliable solder joints caused by product miniaturization and pin-in-paste applications. Rectangle-shaped pieces of solder are added to a solder paste print using standard pick and place equipment. Preform alloy and solder paste alloy are the same, so they both reflow at the same time and temperature. Solder paste supplies the flux and preform increases solder volume. You get consistent, repeatable, and robust solder joints, using existing equipment, with little or no additional cycle time. Improves: solder fillet shape and volume, first-pass yield, finished goods quality, drop test results. Reduces: rework and repair, flux residue issues, field failures, time and cost vs. wave or selective soldering. All reels 13" diameter/15,000 parts per reel.

Specifications:

Size: 0402

Dimensions: .020" x .040" x .019"

Volume: .25 cubic mm

Alloy: Sn63 Pb37