Ideal for the economical cleaning of electronic print circuit boards, SMT stencil cleaning, tool cleaning, and general surface wiping. IPA dissolves a wide range of polar and non-polar soils. It is often used to remove light oils, fingerprints, cutting fluids, flux residues, carbon deposits and mold release. It is also readily miscible in water, so can be used as a drying agent as well. At 70% IPA/30% DI water, a controlled evaporation allows soak time.
The 1608-100FL flip-top tubs have a spring-loaded lid that automatically closes and its sealed top reduces waste from dry-out. Use replacement wipes 1608-100R.
Techspray Alcohol Cleaning Guide 2021
Techspray 1608 Wipes Datasheet
Techspray 1608-1608CP Wipes Safety Datasheet