• Halide-free, air reflow, no-clean solder paste formulated to leave a benign, probe-testable residue
• Residue is easily penetrated and will not clog multi-point probes
• Consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting
• Will perform well on high-speed surface mount lines utilizing fast print speeds and rapid chip placement
• Meets or surpasses all ANSI/J-STD-004, -005 specifications and Bellcore test criteria
• Probe-testable residue and extended open time
• Consistent fine-pitch printing and high humidity resistance
• Strong initial tack strength and long-term stability

NC-SMQ®92J is a halogen-free, air reflow, no-clean solder paste formulated to leave a benign, probe-testable residue. The residue is easily penetrated and will not clog multi-point probes. This product has other qualities such as consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting. NC-SMQ®92J will perform well on high-speed surface mount lines utilizing fast print speeds and rapid chip placement. NC-SMQ®92J meets or surpasses all ANSI/J-STD-004, -005 specifications, and Bellcore test criteria.