ALPHA HiTech 251069.0036GMI Heat Curable Edgebond, CF12-4485B, Iwashita Syringe, 36 gram, 30cc

Manufacturer Part Number: 251069.0036GMI
Part Number: 10020405
Shipping Weight: 0.40 pounds
Quantity Price
10 $70.90
20 - 40 $69.43
50 - 90 $65.78
100 or more $64.32
This item must be ordered in multiples of 10.
Availability: Special order
This item is subject to a hazardous shipping surcharge
Product Features
  • Due to the low Tg it is optimally suited for Consumer Electronics / White Goods / Wearables / Medical / Power tools
  • Excellent Adhesion on FR4 board
  • Lower Temperature Cure capability
  • Anhydride Free
Product Description

ALPHA HiTech CF12-4485B is an excellent and effective low cost option to conventional underfilling process because higher material volume for capillary flow is not required. Provides excellent adhesion strength, excellent thermal cycling performance, and multiple curing options. Well suited for consumer electronics assemblies. Product is Halogen Free

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